| Technology | |
| Sensor | A-Si |
| Scintillator | GOS / CSI |
| Active Area | 128 x 160 mm |
| Pixel Matrix | 1024 x 1248 |
| Pixel Pitch | 125 μm |
| AD Conversion | 16 bits |
| Interface | |
| Communication Interface | Gigabit Ethernet |
| Exposure Control | Pulse Sync In (Edge or Level) / Pulse Sync Out (Edge or Level) |
| Mode | Software Mode / HVG Sync Mode / FPD Sync Mode |
| Frame Speed | 30fps(1x1) |
| Operating System | Windows7 / Windows10 OS 32 bits or 64 bits |
| Technical Performance | |
| Resolution | 4.0 lp/mm |
| Energy Range | 40-350 KV |
| Lag | ＜1% 1st frame |
| Dynamic Range | ≥ 86dB |
| Sensitivity | 460 lsb/uGy |
| SNR | 49 dB @(20000lsb) |
| MTF | 75% @(1 lp/mm) |
| 41% @(2 lp/mm) | |
| 25% @(3 lp/mm) | |
| DQE | 62% @(0 lp/mm) |
| 45% @(1 lp/mm) | |
| 28% @(2 lp/mm) | |
| Mechanical | |
| Dimension(HxWxD) | 222 x 190 x 49 mm |
| Weight | 4.1 Kg |
| Sensor Protection Material | Carbon Fiber |
| Housing Material | Aluminum Alloy |
| Environmental | |
| Temperature Range | 10~35℃(operating); -10~50℃(storage) |
| Humidity | 30~70% RH(non-condensing) |
| Vibration | IEC/EN 60721-3 class 2M3(10~150 Hz, 0.5 g) |
| Shock | IEC/EN 60721-3 class 2M3(11 ms, 2 g) |
| Dust and Water Resistant | IPX0 |
| Power | |
| Supply | 100~240 VAC |
| Frequency | 50/60 Hz |
| Consumption | 8W |
| Application | |
| Industry |
SMT, Electronics, Lithium Battery Chip and Wire Bonding Inspection |
|
Mechanical Dimension |
|