Technology | |
Sensor | A-Si |
Scintillator | CSI / GOS |
Active Area | 286 x 286 mm |
Pixel Matrix | 2048 x 2048 |
Pixel Pitch | 140 μm |
AD Conversion | 16 bits |
Interface | |
Communication Interface | Gigabit Ethernet |
Exposure Control | Pulse Sync In(Edge or Level) / Pulse Sync Out(Edge or Level) |
Mode | Software Mode/HVG Sync Mode/ FPD Sync Mode |
Frame Speed | 8fps(1x1) |
Operating System | Windows7 / Windows10 OS 32 bits or 64 bits |
Technical Performance | |
Resolution | 3.5 lp/mm |
Energy Range | 40-350 KV |
Lag | ≤1% @1st frame |
Dynamic Range | ≥86dB |
Sensitivity | 540 lsb/uGy |
SNR | 48 dB @(20000lsb) |
MTF | 70% @(1 lp/mm) |
38% @(2 lp/mm) | |
21% @(3 lp/mm) | |
DQE | 58% @(0 lp/mm) |
41% @(1 lp/mm) | |
25% @(2 lp/mm) | |
Mechanical | |
Dimension(H x W x D) | 322 x 322 x 46.5 mm |
Weight | 5.5 Kg |
Sensor Protection Material | Carbon Fiber |
Housing Material | Aluminum Alloy |
Environmental | |
Temperature Range | 10~35℃(operating);-10~50℃(storage) |
Humidity | 30~70% RH(non-condensing) |
Vibration | IEC/EN 60721-3 class 2M3(10~150 Hz,0.5 g) |
Shock | IEC/EN 60721-3 class 2M3(11 ms,2 g) |
Dust and Water Resistant | IP41 |
Power | |
Supply | 100~240 VAC |
Frequency | 50/60 Hz |
Consumption | 10W |
Regulatory | |
CFDA (China) | |
FDA (USA) | |
CE (Europe) | |
Application | |
Industry |
SMT, Electronics, Lithium Battery and Chip Wire Bonding Inspection |
Mechanical Dimension |
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