| Technology | |
| Sensor | A-Si |
| Scintillator | CSI / GOS |
| Active Area | 250 x 286 mm |
| Pixel Matrix | 1792 x 2048 |
| Pixel Pitch | 140 μm |
| AD Conversion | 16 bits |
| Interface | |
| Communication Interface | Gigabit Ethernet |
| Exposure Control | Pulse Sync In(Edge or Level) / Pulse Sync Out(Edge or Level) |
| Mode | Software Mode/HVG Sync Mode/ FPD Sync Mode |
| Frame Speed | <=10fps |
| Operating System | Windows7 / Windows10 OS 32 bits or 64 bits |
| Technical Performance | |
| Resolution | 3.5 lp/mm |
| Energy Range | 40-350 KV |
| Lag | ≤1% @ 1st frame |
| Dynamic Range | ≥86dB |
| Sensitivity | 540 lsb/uGy |
| SNR | 48 dB @(20000lsb) |
| MTF | 70% @(1 lp/mm) |
| 38% @(2 lp/mm) | |
| 21% @(3 lp/mm) | |
| DQE | 58% @(0 lp/mm) |
| 41% @(1 lp/mm) | |
| 25% @(2 lp/mm) | |
| Mechanical | |
| Dimension(H x W x D) | 322 x 285x 50.6 mm |
| Weight | 6.2 Kg |
| Sensor Protection Material | Carbon Fiber |
| Housing Material | Aluminum Alloy |
| Environmental | |
| Temperature Range | 10~35℃(operating);-10~50℃(storage) |
| Humidity | 30~70% RH(non-condensing) |
| Vibration | IEC/EN 60721-3 class 2M3(10~150 Hz,0.5 g) |
| Shock | IEC/EN 60721-3 class 2M3(11 ms,2 g) |
| Dust and Water Resistant | IPX0 |
| Power | |
| Supply | 100~240 VAC |
| Frequency | 50/60 Hz |
| Consumption | 10W |
| Regulatory | |
| CFDA (China) | |
| FDA (USA) | |
| CE (Europe) | |
| Application | |
| Industry |
SMT, Electronics, Lithium Battery and Chip Wire Bonding Inspection |
|
Mechanical Dimension |
|