|
Technology |
|
|
Sensor |
A-Si |
|
Scintillator |
GOS / CSI |
|
Active Area |
160 x 128 mm |
|
Pixel Matrix |
1024 x 1248 |
|
Pixel Pitch |
125 μm |
|
AD Conversion |
16 bits |
|
Interface |
|
|
Communication Interface |
Gigabit Ethernet |
|
Exposure Control |
Pulse Sync In (Edge or Level) / Pulse Sync Out (Edge or Level) |
|
Mode |
Software Mode / HVG Sync Mode / FPD Sync Mode |
|
Frame Speed |
30fps |
|
Operating System |
Windows7 / Windows10 OS 32 bits or 64 bits |
|
Technical Performance |
|
|
Resolution |
4.0 lp/mm |
|
Energy Range |
40-160 KV |
|
Lag |
0.8% @1st frame |
|
Dynamic Range |
≥ 86dB |
|
Sensitivity |
460 lsb/uGy |
|
SNR |
49 dB @(20000lsb) |
|
MTF |
75% @(1 lp/mm) |
|
46% @(2 lp/mm) |
|
|
27% @(3 lp/mm) |
|
|
DQE |
58% @(0 lp/mm) |
|
43% @(1 lp/mm) |
|
|
30% @(2 lp/mm) |
|
|
Mechanical |
|
|
Dimension(HxWxD) |
196 x 162 x 37.5 mm |
|
Weight |
1.5 Kg |
|
Sensor Protection Material |
Carbon Fiber |
|
Housing Material |
Aluminum Alloy |
|
Environmental |
|
|
Temperature Range |
10~35℃(operating); -10~50℃(storage) |
|
Humidity |
30~70% RH(non-condensing) |
|
Vibration |
IEC/EN 60721-3 class 2M3(10~150 Hz, 0.5 g) |
|
Shock |
IEC/EN 60721-3 class 2M3(11 ms, 2 g) |
|
Dust and Water Resistant |
IPX0 |
|
Power |
|
|
Supply |
100~240 VAC |
|
Frequency |
50/60 Hz |
|
Consumption |
8W |
|
Application |
|
|
Industry |
SMT, Electronics, Lithium Battery Chip and Wire Bonding Inspection |
|
Mechanical Dimension |
|