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Personlized Products Cr System Radiology - Dolphin0606FDI CMOS Industrial X-ray detector – haobo

Dolphin0606FDI production is a fixed type and low noise x-ray flat panel detector based on CMOS. CMOS sensors use a single crystal silicon process for chip fabrication. Direct integral amplification within pixel cells leads to lower electronic noise, higher signal-to-noise ratio, and higher quantum detection efficiency (DQE) than amorphous silicon, so CMOS sensors are particularly suitable for low-dose imaging scenarios. Based on above characteristics, Dolphin0606FDI detector can be widely used in industrial SMT, electronics, lithium battery and chip wire bonding inspection. Electronic noise is lower Higher signal-to-noise ratio

Technology

Sensor

CMOS

Scintillator

CSI

Active Area

60 x 53.5 mm

Pixel Matrix

1200 x 1056

Pixel Pitch

50 μm

AD Conversion

14 bits

Interface

Communication Interface

Optical Fiber

Exposure Control 

Pulse Sync In (Edge or Level) / Pulse Sync Out (Edge or Level)

Work Mode

Software Mode / HVG Sync Mode / FPD Sync Mode

Frame Speed

51fps (1x1)

Operating System 

Windows7 / Windows10 OS 32 bits or 64 bits

Technical Performance

Resolution

10.0 lp/mm

Energy Range

40~160 KV

Lag 

0.01% @1st frame

Dynamic Range 

≥ 73dB

Sensitivity 

100 lsb/uGy

SNR 

48 dB @(20000lsb)

MTF 

90% @(1 lp/mm)

82% @(2 lp/mm)

74% @(3 lp/mm)

DQE (2uGy) 

65% @(0 lp/mm)

48% @(1 lp/mm)

37% @(2 lp/mm)

Mechanical

Dimension(H x W x D) 

171 x 171 x 37 mm

Weight 

2.8 Kg

Sensor Protection Material

Carbon Fiber

Housing Material 

Aluminum Alloy

Environmental

Temperature Range 

10~35°℃ (operating); -10~50℃(storage)

Humidity

30~70% RH(non-condensing)

Vibration

IEC/EN 60721-3 class 2M3(10~150 Hz,0.5 g)

Shock 

IEC/EN 60721-3 class 2M3(11 ms,2 g)

Dust and Water Resistant

IPX0

Power

Supply 

100~240 VAC

Frequency 

50/60 Hz

Consumption

6 W

Application

Industrial

SMT, Electronics, Lithium Battery

Chip Wire Bonding Inspection

Mechanical Dimension