Technology |
|
Sensor |
A-Si |
Scintillator |
GOS / CSI |
Active Area |
428.8 x 428.8 mm |
Pixel Matrix |
4288 x 4288 |
Pixel Pitch |
100 μm |
AD Conversion |
16 bits |
Interface |
|
Communication Interface |
Gigabit Ethernet |
Exposure Control |
Trigger In(Edge or Level) / Trigger Out (Edge or Level) |
Image Acquisition Time |
≤1 s |
Operating System |
Windows7 / Windows10 OS 32 bits or 64 bits |
Technical Performance |
|
Resolution |
5.0 lp/mm |
Energy Range |
40-160 KV |
Lag |
≤0.8% 1st frame |
Dynamic Range |
≥76dB |
Sensitivity |
360 lsb/uGy |
SNR |
47 dB @(20000lsb) |
MTF |
75% @(1 lp/mm) |
48% @(2 lp/mm) |
|
29% @(3 lp/mm) |
|
DQE |
52% @(0 lp/mm) |
38% @(1 lp/mm) |
|
21% @(2 lp/mm) |
|
Mechanical |
|
Dimension(H x W x D) |
470x 470 x 34.5 mm |
Weight |
5.0 Kg |
Sensor Protection Material |
Carbon Fiber |
Housing Material |
High Strength Aluminum Alloy |
Environmental |
|
Temperature Range |
10~35°℃(operating);-10~50℃(storage) |
Humidity |
30~70% RH(non-condensing) |
Vibration |
IEC/EN 60721-3 class 2M3(10~150 Hz,0.5 g) |
Shock |
IEC/EN 60721-3 class 2M3(11 ms,2 g) |
Dust and Water Resistant |
IPX0 |
Power |
|
Supply |
100~240 VAC |
Frequency |
50/60 Hz |
Consumption |
18 W |
Application |
|
Industry |
NDT (Non-Destructive Testing) X Ray Chip Counter |
Mechanical Dimension |
|
|